Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process

This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement...

Full description

Bibliographic Details

Main Author:	A.E., Kurnosenko (author)
Other Authors:	D.I., Arabov (author)
Format:	article
Language:	English
Published:	2017
Online Access:	https://knepublishing.com/index.php/KnE-Engineering/article/view/1111 http://ridda2.utp.ac.pa/handle/123456789/4347
Tags:	Add Tag No Tags, Be the first to tag this record!